Best Phone Arena - LG denies any Snapdragon 810 heating issue on the G Flex 2, While there are recent considerations over the heating problems with the Qualcomm flower 810 chipset, LG, UN agency is victimization an equivalent processor on its forthcoming G Flex two, does not appear to possess any drawback.
At a press event for the G Flex two, LG vice chairman for mobile product coming up with Woo Ram-chan aforementioned "I am substantially conscious of the varied considerations within the market concerning the (Snapdragon) 810, however the chip's performance is kind of satisfactory," and "I do not perceive why there's a problem over heat."
The flower 810 heating problems that Ram-chan dismisses here were apparently severe enough for Samsung to abandon the 810 chipset for its forthcoming Galaxy S6 and instead use its own Exynos processor solely now. ar going to} need to wait and see if the heating problems are real or not once we take a look at the G Flex two.
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